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Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs.
Myat Thu Linn Aung
Takefumi Yoshikawa
Chuan Seng Tan
Tony Tae-Hyoung Kim
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2017)
Keyphrases
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electron microscopy
mechanical properties
image processing
multiscale
database
data sets
multimedia
denoising
image enhancement
convex optimization
mixed mode