H. Y. Li

Publication Activity (10 Years)

Years Active: 2004-2017
Publications (10 Years): 2

Top Topics

Hardware Architecture

Schema Matching

Top Venues

Trans. Emerg. Telecommun. Technol.

Publications

H. Y. Li, J. J. Tang, C. T. Yu, W. W. Hu, W. J. Chang, D. H. Lee, Y. C. Chung
A novel hardware architecture of CAN applications. ICCE (2017)
C. L. Guo, H. Y. Li
A review on polarization-based spectrum sensing. Trans. Emerg. Telecommun. Technol. 27 (10) (2016)
Kwang-Tsao Shao, Kun-Chi Lai, Jack Yung-Chang Lin, L. S. Chen, H. Y. Li, Cheng-Hsin Hsu, Han Lee, H. W. Hsu, Guan-Shuo Mai
Experience and Strategy of Biodiversity Data Integration in Taiwan. Data Sci. J. 12 (2013)
J. Zhang, L. Zhang, Y. Dong, H. Y. Li, Cher Ming Tan, G. Xia, Chuan Seng Tan
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. 3DIC (2013)
Sheng-Bo Chen, G. Z. Zhang, Z. J. Wang, H. Y. Li
Tomographic retrieval of atmosphere temperature profiles from Limb infrared emission by ENVISAT MIPAS. IGARSS (2011)
H. Y. Li, Y. K. Wong, Wai-Lok Chan
The asymptotic structure of the Morris-Lecar model. Neurocomputing 74 (12-13) (2011)
H. Y. Li, L. Xie, L. G. Ong, A. Baram, I. Herer, Arnon Hirshberg, S. C. Chong, D. L. Kwong
Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application. 3DIC (2011)
H. Y. Li, Y. K. Wong, Wai-Lok Chan, Kai Ming Tsang
control. Neurocomputing 74 (1-3) (2010)
H. Y. Li, Y. F. Zhang
Automatic tool-path generation in 5-axis finish cut with multiple cutters. VECIMS (2009)
C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectron. Reliab. 45 (3-4) (2005)
H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang
) dual damascene interconnection. Microelectron. Reliab. 45 (7-8) (2005)
C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectron. J. 35 (9) (2004)