Y. J. Su

Publication Activity (10 Years)

Years Active: 2003-2010
Publications (10 Years): 0

Publications

Kuo-Tai Fan, Yu-Chang Tzeng, Y. F. Lin, Y. J. Su, Kun-Shan Chen
Tree identification using a distributed K-mean clustering algorithm. IGARSS (2010)
Yu-Chang Tzeng, Kuo-Tai Fan, Y. J. Su, Kun-Shan Chen
A Parallel Differential Box Counting Algorithm Applied to Hyperspectral Image Classifications. IGARSS (5) (2009)
C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectron. Reliab. 45 (3-4) (2005)
H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang
) dual damascene interconnection. Microelectron. Reliab. 45 (7-8) (2005)
C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectron. J. 35 (9) (2004)
Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo
Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectron. Reliab. 43 (8) (2003)
Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron. J. 34 (2) (2003)
C. F. Tsang, V. N. Bliznetsov, Y. J. Su
Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. Microelectron. J. 34 (11) (2003)