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Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
C. F. Tsang
C. Y. Li
A. Krishnamoorthy
Y. J. Su
H. Y. Li
L. Y. Wong
W. H. Li
L. J. Tang
K. Y. Ee
Published in:
Microelectron. J. (2004)
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