P. D. Foo

Publication Activity (10 Years)

Years Active: 2003-2003
Publications (10 Years): 0

Publications

Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo
Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectron. Reliab. 43 (8) (2003)
Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron. J. 34 (2) (2003)