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Investigation of defect on copper bond pad surface in copper/low k process integration.

Y. S. ZhengY. J. SuB. YuP. D. Foo
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • viewpoint
  • wire bonding
  • d objects
  • bond pad
  • thin film
  • data mining
  • three dimensional
  • databases
  • information systems
  • computer simulation
  • business process management
  • printed circuit boards