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Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.
Dau Fatt Lim
Shiv Govind Singh
Xiao Fang Ang
Jun Wei
Chee Mang Ng
Chuan Seng Tan
Published in:
3DIC (2009)
Keyphrases
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electron microscopy
mechanical properties
anisotropic diffusion
diffusion process
image processing
multi agent systems
x ray
real time
databases
social networks
decision making
learning environment
expert systems
artificial neural networks
diffusion processes