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Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.
Liangxing Hu
Simon Chun Kiat Goh
Yu Dian Lim
Peng Zhao
Michael Joo Zhong Lim
Chuan Seng Tan
Published in:
3DIC (2021)
Keyphrases
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objective function
mechanical properties
electron microscopy
thin film
ambient intelligence
learning algorithm
multiscale
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environmental conditions
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