Lan Peng

Publication Activity (10 Years)

Years Active: 2010-2022
Publications (10 Years): 9

Top Topics

Procrustes Analysis

Vehicle Routing

Top Venues

IEEE Commun. Lett.

Publications

Lan Peng, Chase C. Murray
VeRoViz: A Vehicle Routing Visualization Toolkit. INFORMS J. Comput. 34 (4) (2022)
Yi Sun, Hong Shen, Zhenguo Du, Lan Peng, Chunming Zhao
ICINet: ICI-Aware Neural Network Based Channel Estimation for Rapidly Time-Varying OFDM Systems. CoRR (2021)
Yi Sun, Hong Shen, Zhenguo Du, Lan Peng, Chunming Zhao
ICINet: ICI-Aware Neural Network Based Channel Estimation for Rapidly Time-Varying OFDM Systems. IEEE Commun. Lett. 25 (9) (2021)
Huifeng Wu, Danfeng Sun, Lan Peng, Yuan Yao, Jia Wu, Quan Z. Sheng, Yi Yan
Dynamic Edge Access System in IoT Environment. IEEE Internet Things J. 7 (4) (2020)
Lan Peng, Lin Ma, Naichao Wang
A fleet-level selective maintenance model for long-distance highway transportation considering stochastic repair quality. ICSRS (2017)
Qianli Ma, Ping Yang, Pengfei Wang, Lan Peng, Xu He, Bin Fu, Yue Xiao
Power Allocation for OFDM with Index Modulation. VTC Spring (2017)
Feng Yu, Xia Lei, Lan Peng, Yue Xiao, Peng Wei, Xiaojie Wen
Performance Analysis of Spatial Modulation OFDM System with N-Continuous Precoder. VTC Spring (2016)
Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 3DIC (2016)
Qianli Ma, Yue Xiao, Lilin Dan, Ping Yang, Lan Peng, Shaoqian Li
Subcarrier Allocation for OFDM With Index Modulation. IEEE Commun. Lett. 20 (7) (2016)
Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC (2015)
Lan Peng, Saidan Gong, Lilin Dan, Yue Xiao
Energy-Efficient Proportional Resource Allocation in Uplink OFDMA Systems. VTC Spring (2015)
Xiang Li, Lin Ma, Lan Peng, Jingfu Wang
A modeling and simulation approach for support network considering multi-service flows. IEEM (2015)
Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 3DIC (2010)