Markus Wimplinger

Publication Activity (10 Years)

Years Active: 2008-2016
Publications (10 Years): 1

Top Topics

Global Alignment

Recent Progress

Intelligent Control

Top Venues

Publications

Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 3DIC (2016)
Thomas Uhrmann, Thorsten Matthias, Markus Wimplinger, Jurgen Burggraf, Daniel Burgstaller, Harald Wiesbauer, Paul Lindner
Recent progress in thin wafer processing. 3DIC (2013)
Bioh Kim, Thorsten Matthias, Markus Wimplinger, Paul Lindner
Advanced wafer bonding solutions for TSV integration with thin wafers. 3DIC (2009)
Herwig Kirchberger, Paul Lindner, Markus Wimplinger
Novel Bonding technologies for wafer-level transparent packaging of MOEMS CoRR (2008)