Advanced wafer bonding solutions for TSV integration with thin wafers.

Bioh Kim Thorsten Matthias Markus Wimplinger Paul Lindner

Published in: 3DIC (2009)

Keyphrases

integrated circuit
semiconductor manufacturing
solution space
data fusion
data sets
database
databases
data mining
computer vision
optimal solution
data integration
search methods
benchmark problems
solution quality
massively parallel
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