Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.
Joeri De VosLan PengAlain PhommahaxayJoost Van OngevalAndy MillerEric BeyneFlorian KurzThomas WagenleiterMarkus WimplingerThomas UhrmannPublished in: 3DIC (2016)
Keyphrases
- high density
- low density
- image alignment
- magnetic recording
- control system
- input output
- close proximity
- data analysis
- global alignment
- control method
- thin film
- multiple sequence alignment
- lower cost
- procrustes analysis
- neural network
- magnetic tape
- intelligent control
- steady state
- markov chain
- low cost
- genetic algorithm