Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
Soon-Wook KimLan PengAndy MillerGerald BeyerEric BeyneChung-Sun LeePublished in: 3DIC (2015)
Keyphrases
- thin film
- plasma etching
- chemical vapor deposition
- chemical reactions
- integrated circuit
- high density
- low density
- multi agent
- semiconductor manufacturing
- image processing
- high energy
- information retrieval
- chemical engineering
- decision trees
- multiscale
- data structure
- real time
- artificial intelligence
- electrical properties
- neural network
- data sets