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Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.
Lan Peng
Hongyu Li
Dau Fatt Lim
Riko I. Made
Guo-Qiang Lo
Dim-Lee Kwong
Chuan Seng Tan
Published in:
3DIC (2010)
Keyphrases
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semiconductor manufacturing
integrated circuit
electron microscopy
mechanical properties
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