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Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.
Chuan Seng Tan
Dau Fatt Lim
Xiao Fang Ang
J. Wei
K. C. Leong
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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electron microscopy
mechanical properties
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