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3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds.
Revanth Nadipalli
Ji Fan
Holden King Ho Li
Keng Hoong Wee
Hao Yu
Chuan Seng Tan
Published in:
3DIC (2011)
Keyphrases
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mechanical properties
electron microscopy
low voltage
low cost
database
case study
computer science
high speed
data integration
circuit design
finite element model
information integration
transmission line
mechanical design
electro mechanical