Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element.
Ye LinChuan Seng TanPublished in: 3DIC (2016)
Keyphrases
- high speed
- energy consumption
- embedded systems
- low cost
- data storage
- energy efficiency
- power supply
- dynamic random access memory
- analog vlsi
- circuit design
- energy saving
- flash memory
- storage and retrieval
- storage requirements
- file system
- short circuit
- random access
- single chip
- cmos technology
- vlsi implementation
- wireless sensor networks