Kuan-Neng Chen

ORCID

Publication Activity (10 Years)

Years Active: 2002-2022
Publications (10 Years): 11

Top Venues

3DIC

ISCAS

IEEE Trans. Biomed. Circuits Syst.

ISSCC

Massachusetts Institute of Technology, Cambridge, MA, USA (PHD)

Education History

Massachusetts Institute of Technology, Cambridge, MA, USA

PHD

Publications

Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. VLSI Technology and Circuits (2022)
Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. VLSI Technology and Circuits (2022)
Po-Chih Chen, Demin Liu, Kuan-Neng Chen
Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C. 3DIC (2019)
Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC (2019)
Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. 3DIC (2019)
Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen
Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. 3DIC (2019)
Po-Tsang Huang, Yu-Chieh Huang, Shang-Lin Wu, Yu-Chen Hu, Ming-Wei Lu, Ting-Wei Sheng, Fung-Kai Chang, Chun-Pin Lin, Nien-Shang Chang, Hung-Lieh Chen, Chi-Shi Chen, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer. ISCAS (2017)
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes. IEEE Trans. Biomed. Circuits Syst. 11 (5) (2017)
Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
The influence of device morphology on wafer-level bonding with polymer-coated layer. 3DIC (2016)
Yu-Tao Yang, Yu-Chen Hu, Kuan-Neng Chen
Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration. 3DIC (2016)
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. ISCAS (2016)
Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. 3DIC (2015)
Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC (2015)
Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Hsuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Ho-Ming Tong
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications. IEEE Trans. Biomed. Circuits Syst. 8 (6) (2014)
Tang-Hsuan Wang, Po-Tsang Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
Energy-efficient configurable discrete wavelet transform for neural sensing applications. ISCAS (2014)
Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-Lung Lin, Ho-Ming Tong
18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. ISSCC (2014)
Shang-Lin Wu, Po-Tsang Huang, Teng-Chieh Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
Energy-efficient low-noise 16-channel analog-front-end circuit for bio-potential acquisition. VLSI-DAT (2014)
Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kuo-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen
Low temperature (<180 °C) bonding for 3D integration. 3DIC (2013)
Teng-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications. BioCAS (2013)
Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong
Through-silicon-via-based double-side integrated microsystem for neural sensing applications. ISSCC (2013)
Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Olesya Zakoretska, Ching-Te Chuang, Kuan-Neng Chen, Chen-Chao Wang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang
Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection. ISCAS (2013)
Cheng-Ta Ko, Kuan-Neng Chen
Reliability of key technologies in 3D integration. Microelectron. Reliab. 53 (1) (2013)
S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen
BCB-to-oxide bonding technology for 3D integration. Microelectron. Reliab. 52 (2) (2012)
Cheng-Ta Ko, Kuan-Neng Chen
Low temperature bonding technology for 3D integration. Microelectron. Reliab. 52 (2) (2012)
Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen
Wafer-level Cu-Cu bonding technology. Microelectron. Reliab. 52 (2) (2012)
Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang
On-chip self-calibrated process-temperature sensor for TSV 3D integration. SoCC (2012)
Kuan-Neng Chen, Chuan Seng Tan
Integration schemes and enabling technologies for three-dimensional integrated circuits. IET Comput. Digit. Tech. 5 (3) (2011)
Kuan-Neng Chen, Z. Xu, F. Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo
Cu-based bonding technology for 3D integration applications. 3DIC (2011)
Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC (2011)
Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen
Wafer-level 3D integration using hybrid bonding. 3DIC (2010)
Cheng-Ta Ko, Kuan-Neng Chen
Wafer-level bonding/stacking technology for 3D integration. Microelectron. Reliab. 50 (4) (2010)
Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kuan-Neng Chen, Kenneth Rose, Jian-Qiang Lu
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network. 3DIC (2010)
Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis
Wafer-level 3D integration technology. IBM J. Res. Dev. 52 (6) (2008)
Shamik Das, Andy Fan, Kuan-Neng Chen, Chuan Seng Tan, Nisha Checka, Rafael Reif
Technology, performance, and computer-aided design of three-dimensional integrated circuits. ISPD (2004)
Rafael Reif, Andy Fan, Kuan-Neng Chen, Shamik Das
Fabrication Technologies for Three-Dimensional Integrated Circuits (invited). ISQED (2002)

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Publication Activity (10 Years)

Top Topics

Top Venues

Kuan-Neng Chen