BCB-to-oxide bonding technology for 3D integration.

S. L. Lin W. C. Huang C. T. Ko Kuan-Neng Chen

Published in: Microelectron. Reliab. (2012)

Keyphrases

data processing
technological advances
learning algorithm
data fusion
cost effective
technical solutions
real time
artificial intelligence
information technology
relational databases
software development
personal computer
rapid development