Yi-Chieh Tsai

Publication Activity (10 Years)

Years Active: 2019-2019
Publications (10 Years): 2

Top Topics

Cmos Technology

Mechanical Properties

Top Venues

Publications

Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. 3DIC (2019)
Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen
Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. 3DIC (2019)