Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.

Cheng-Ta Ko Zhi-Cheng Hsiao Y. J. Chang Peng-Shu Chen J. H. Huang Hsin-Chia Fu Y. J. Huang C. W. Chiang W. L. Tsat Y. H. Chen Wei-Chung Lo Kuan-Neng Chen

Published in: 3DIC (2011)

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