Zhi-Cheng Hsiao

Publication Activity (10 Years)

Years Active: 2010-2011
Publications (10 Years): 0

Publications

Kuan-Neng Chen, Z. Xu, F. Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo
Cu-based bonding technology for 3D integration applications. 3DIC (2011)
Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC (2011)
Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen
Wafer-level 3D integration using hybrid bonding. 3DIC (2010)