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Wafer-level 3D integration using hybrid bonding.

Cheng-Ta KoKuan-Neng ChenWei-Chung LoChuan-An ChengWen-Chun HuangZhi-Cheng HsiaoHuan-Chun FuYu-Hua Chen
Published in: 3DIC (2010)
Keyphrases
  • higher level
  • integrated circuit
  • pixel level
  • levels of abstraction
  • neural network
  • machine learning
  • image segmentation
  • multiresolution
  • data fusion
  • information integration
  • massively parallel
  • hybrid approaches