Cheng-Ta Ko

Publication Activity (10 Years)

Years Active: 2010-2013
Publications (10 Years): 0

Top Topics

Manufacturing Enterprises

Multiresolution

Technical Solutions

Top Venues

Microelectron. Reliab.

Publications

Cheng-Ta Ko, Kuan-Neng Chen
Reliability of key technologies in 3D integration. Microelectron. Reliab. 53 (1) (2013)
Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu
Performance and process characteristic of glass interposer with through-glass-via(TGV). 3DIC (2013)
Cheng-Ta Ko, Kuan-Neng Chen
Low temperature bonding technology for 3D integration. Microelectron. Reliab. 52 (2) (2012)
Kuan-Neng Chen, Z. Xu, F. Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo
Cu-based bonding technology for 3D integration applications. 3DIC (2011)
Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC (2011)
Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen
Wafer-level 3D integration using hybrid bonding. 3DIC (2010)
Cheng-Ta Ko, Kuan-Neng Chen
Wafer-level bonding/stacking technology for 3D integration. Microelectron. Reliab. 50 (4) (2010)