Wafer-level bonding/stacking technology for 3D integration.

Cheng-Ta Ko Kuan-Neng Chen

Published in: Microelectron. Reliab. (2010)

Keyphrases

data processing
rapid development
levels of abstraction
heterogeneous platforms
case study
information integration
data integration
data fusion
cost effective
personal computer
key technologies
website
computer science
information technology
st century
technological advances