Cu-based bonding technology for 3D integration applications.

Kuan-Neng Chen Z. Xu F. Liu Cheng-Ta Ko Chuan-An Cheng W. C. Huang H. L. Lin C. Cabral Zhi-Cheng Hsiao N. Klymko Hsin-Chia Fu Y. H. Chen Jian-Qiang Lu Wei-Chung Lo

Published in: 3DIC (2011)

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