Login / Signup

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging.

Zhong-Jie HongDemin LiuShu-Ting HsiehHan-Wen HuMing-Wei WengChih-I ChoJui-Han LiuKuan-Neng Chen
Published in: VLSI Technology and Circuits (2022)
Keyphrases
  • room temperature
  • electron microscopy
  • thin film
  • mechanical properties
  • detection scheme
  • classification scheme
  • high density
  • user interface
  • data model
  • motion estimation
  • high speed
  • data integration
  • cellular automata