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Young-Suk Kim
ORCID
Publication Activity (10 Years)
Years Active: 2007-2022
Publications (10 Years): 6
Top Topics
Stress Distribution
Von Mises
Integrated Circuit
Gate Dielectrics
Top Venues
3DIC
Sensors
IRPS
VLSI Technology and Circuits
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Publications
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Kyosuke Kobinata
,
Tatsuya Funaki
,
Yoshiaki Satake
,
Hitoshi Matsuno
,
Seiji Hidaka
,
Shunsuke Abe
,
Hiroyuki Ito
,
Chih-Cheng Hsiao
,
Sheng Yi Li
,
Young-Suk Kim
,
Takayuki Ohba
Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network.
VLSI Technology and Circuits
(2022)
Zhwen Chen
,
Young-Suk Kim
,
Tadashi Fukuda
,
Koji Sakui
,
Takayuki Ohba
,
Tatsuji Kobayashi
,
Takashi Obara
Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs.
IRPS
(2021)
Yae Rim Choi
,
Jaewon Shim
,
Jae-Ho Park
,
Young-Suk Kim
,
Min Jung Kim
Discovery of Orphan Olfactory Receptor 6M1 as a New Anticancer Target in MCF-7 Cells by a Combination of Surface Plasmon Resonance-Based and Cell-Based Systems.
Sensors
21 (10) (2021)
Chia-Hsuan Lee
,
Hsin-Chi Chang
,
Jui-Han Liu
,
Hiroyuki Ito
,
Young-Suk Kim
,
Kuan-Neng Chen
,
Takayuki Ohba
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.
3DIC
(2019)
Tomoji Nakamura
,
Yoriko Mizushima
,
Young-Suk Kim
,
Ryuichi Sugie
,
Takayuki Ohba
Characterization of stress distribution in ultra-thinned DRAM wafer.
3DIC
(2015)
Takayuki Ohba
,
Young-Suk Kim
,
Yoriko Mizushima
,
Nobuhide Maeda
,
Koji Fujimoto
,
Shoichi Kodama
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation.
IEICE Electron. Express
12 (7) (2015)
Yoriko Mizushima
,
Young-Suk Kim
,
Tomoji Nakamura
,
Shoichi Kodama
,
Nobuhide Maeda
,
Koji Fujimoto
,
Takayuki Ohba
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure.
3DIC
(2014)
Tadao Nakamura
,
Yoriko Mizushima
,
Hideki Kitada
,
Young-Suk Kim
,
Nobuhide Maeda
,
Shoichi Kodama
,
Ryuichi Sugie
,
Hiroshi Hashimoto
,
Akihito Kawai
,
Kazuhisa Arai
,
Akira Uedono
,
Takayuki Ohba
Influence of wafer thinning process on backside damage in 3D integration.
3DIC
(2013)
Sang Mi Lee
,
Gil-Ok Shin
,
Kyung Min Park
,
Pahn-Shick Chang
,
Young-Suk Kim
Determination of Odor Release in Hydrocolloid Model Systems Containing Original or Carboxylated Cellulose at Different pH Values Using Static Headspace Gas Chromatographic (SHS-GC) Analysis.
Sensors
13 (3) (2013)
Osamu Nakatsuka
,
Hideki Kitada
,
Young-Suk Kim
,
Yoriko Mizushima
,
Tomoji Nakamura
,
Takayuki Ohba
,
Shigeaki Zaima
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.
3DIC
(2011)
Nobuhide Maeda
,
Young-Suk Kim
,
Y. Hikosaka
,
T. Eshita
,
Hideki Kitada
,
K. Fujimoto
,
Yoriko Mizushima
,
K. Suzuki
,
Tadao Nakamura
,
Akihito Kawai
,
Kazuhisa Arai
,
Takayuki Ohba
Development of ultra-thinning technology for logic and memory heterogeneous stack applications.
3DIC
(2011)
Sun-Young Lee
,
Yong-Ho Lee
,
Jin-Wook Beak
,
Young-Suk Kim
,
Heyrin Kim
,
In-Kwon Lee
Video word balloon authoring system.
SIGGRAPH Asia Posters
(2011)
Young-Suk Kim
,
Joon-Woo Lee
,
Seongrae Park
,
ByoungCheol Choi
Mobile advertisement system using data push scheduling based on user preference.
WTS
(2009)
Yu Tian
,
Lei Yan
,
Gun-Young Park
,
Seung-Han Yang
,
Young-Suk Kim
,
Sang-Ryong Lee
,
Choon-Young Lee
Application of RRT-based local Path Planning Algorithm in Unknown Environment.
CIRA
(2007)