Login / Signup

Influence of wafer thinning process on backside damage in 3D integration.

Tadao NakamuraYoriko MizushimaHideki KitadaYoung-Suk KimNobuhide MaedaShoichi KodamaRyuichi SugieHiroshi HashimotoAkihito KawaiKazuhisa AraiAkira UedonoTakayuki Ohba
Published in: 3DIC (2013)
Keyphrases
  • artificial neural networks
  • neural network
  • data sets
  • preprocessing
  • manufacturing process
  • multi agent systems
  • manufacturing systems
  • social influence
  • process control