Nobuhide Maeda

Publication Activity (10 Years)

Years Active: 2007-2015
Publications (10 Years): 0

Top Topics

Manufacturing Systems

Social Influence

Top Venues

IEICE Electron. Express

Publications

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12 (7) (2015)
Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC (2014)
Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba
Influence of wafer thinning process on backside damage in 3D integration. 3DIC (2013)
Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC (2011)
Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC (2011)
Kentaro Shibahara, Nobuhide Maeda
Gate-Extension Overlap Control by Sb Tilt Implantation. IEICE Trans. Electron. (5) (2007)