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Nobuhide Maeda
Publication Activity (10 Years)
Years Active: 2007-2015
Publications (10 Years): 0
Top Topics
Manufacturing Systems
Small Scale
Metadata
Social Influence
Top Venues
3DIC
IEICE Electron. Express
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Publications
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Takayuki Ohba
,
Young-Suk Kim
,
Yoriko Mizushima
,
Nobuhide Maeda
,
Koji Fujimoto
,
Shoichi Kodama
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation.
IEICE Electron. Express
12 (7) (2015)
Yoriko Mizushima
,
Young-Suk Kim
,
Tomoji Nakamura
,
Shoichi Kodama
,
Nobuhide Maeda
,
Koji Fujimoto
,
Takayuki Ohba
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure.
3DIC
(2014)
Tadao Nakamura
,
Yoriko Mizushima
,
Hideki Kitada
,
Young-Suk Kim
,
Nobuhide Maeda
,
Shoichi Kodama
,
Ryuichi Sugie
,
Hiroshi Hashimoto
,
Akihito Kawai
,
Kazuhisa Arai
,
Akira Uedono
,
Takayuki Ohba
Influence of wafer thinning process on backside damage in 3D integration.
3DIC
(2013)
Nobuhide Maeda
,
Young-Suk Kim
,
Y. Hikosaka
,
T. Eshita
,
Hideki Kitada
,
K. Fujimoto
,
Yoriko Mizushima
,
K. Suzuki
,
Tadao Nakamura
,
Akihito Kawai
,
Kazuhisa Arai
,
Takayuki Ohba
Development of ultra-thinning technology for logic and memory heterogeneous stack applications.
3DIC
(2011)
Tomoji Nakamura
,
Hideki Kitada
,
Yoriko Mizushima
,
Nobuhide Maeda
,
Koji Fujimoto
,
Takayuki Ohba
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects.
3DIC
(2011)
Kentaro Shibahara
,
Nobuhide Maeda
Gate-Extension Overlap Control by Sb Tilt Implantation.
IEICE Trans. Electron.
(5) (2007)