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Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects.

Tomoji NakamuraHideki KitadaYoriko MizushimaNobuhide MaedaKoji FujimotoTakayuki Ohba
Published in: 3DIC (2011)
Keyphrases
  • comparative study
  • low cost
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  • image processing
  • high density