Takayuki Ohba

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 6

Top Topics

Integrated Circuit

Chemical Vapor Deposition

Top Venues

VLSI Technology and Circuits

Publications

Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. VLSI Technology and Circuits (2023)
Kyosuke Kobinata, Tatsuya Funaki, Yoshiaki Satake, Hitoshi Matsuno, Seiji Hidaka, Shunsuke Abe, Hiroyuki Ito, Chih-Cheng Hsiao, Sheng Yi Li, Young-Suk Kim, Takayuki Ohba
Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. VLSI Technology and Circuits (2022)
Zhwen Chen, Young-Suk Kim, Tadashi Fukuda, Koji Sakui, Takayuki Ohba, Tatsuji Kobayashi, Takashi Obara
Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs. IRPS (2021)
Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC (2019)
Koji Sakui, Takayuki Ohba
High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. 3DIC (2019)
Koji Sakui, Takayuki Ohba
Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. CICC (2019)
Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba
Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC (2015)
Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12 (7) (2015)
Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC (2014)
Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba
Influence of wafer thinning process on backside damage in 3D integration. 3DIC (2013)
Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC (2011)
Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC (2011)
Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC (2011)