Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform.
Koji SakuiTakayuki OhbaPublished in: CICC (2019)
Keyphrases
- low power
- high speed
- three dimensional
- cmos technology
- power dissipation
- real time
- single chip
- high power
- wireless transmission
- digital signal processing
- logic circuits
- power consumption
- frame rate
- low cost
- input output
- low power consumption
- image sensor
- vlsi architecture
- general purpose
- mixed signal
- vlsi circuits
- fully integrated
- multi view
- signal processing
- wireless networks
- gate array