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Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.
Osamu Nakatsuka
Hideki Kitada
Young-Suk Kim
Yoriko Mizushima
Tomoji Nakamura
Takayuki Ohba
Shigeaki Zaima
Published in:
3DIC (2011)
Keyphrases
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integrated circuit
semiconductor manufacturing
massively parallel
low cost
input output
genetic algorithm
manufacturing process
finite element analysis
data sets
computer vision
image sequences
high speed
fiber optic
wafer fabrication