Hideki Kitada

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 1

Top Topics

Manufacturing Process

Social Influence

Top Venues

Publications

Hideki Kitada, Hiroko Tashiro, Shoichi Miyahara, Takeshi Ishitsuka, Aki Dote, Shinji Tadaki, Tatsumi Nakada, Seiki Sakuyama
Study of MOSFET thermal stability with TSV in operation temperature using novel 3D-LSI stress analysis. 3DIC (2016)
Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba
Influence of wafer thinning process on backside damage in 3D integration. 3DIC (2013)
Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC (2011)
Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC (2011)
Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC (2011)