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Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.
Chia-Hsuan Lee
Hsin-Chi Chang
Jui-Han Liu
Hiroyuki Ito
Young-Suk Kim
Kuan-Neng Chen
Takayuki Ohba
Published in:
3DIC (2019)
Keyphrases
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high density
chemical vapor deposition
space charge
integrated circuit
reliability analysis
thin film
field effect transistors
data sets
simplex method
electric field
room temperature
solar radiation
gate dielectrics