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Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.

Chuan-An ChengRyuichi SugieTomoyuki UchidaKou-Hua ChenChi-Tsung ChiuKuan-Neng Chen
Published in: 3DIC (2015)
Keyphrases
  • high density
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  • power distribution
  • distribution networks
  • electrical properties