An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.
Jie ZhangWei LuPo-Tsang HuangSih-Han LiTsung-Yi HungShih-Hsien WuMing-Ji DaiI-Shan ChungWen-Chao ChenChin-Hung WangShyh-Shyuan SheuHung-Ming ChenKuan-Neng ChenWei-Chung LoChih-I WuPublished in: VLSI Technology and Circuits (2022)