An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.

Jie Zhang Wei Lu Po-Tsang Huang Sih-Han Li Tsung-Yi Hung Shih-Hsien Wu Ming-Ji Dai I-Shan Chung Wen-Chao Chen Chin-Hung Wang Shyh-Shyuan Sheu Hung-Ming Chen Kuan-Neng Chen Wei-Chung Lo Chih-I Wu

Published in: VLSI Technology and Circuits (2022)

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