Shan-Chun Yang

Publication Activity (10 Years)

Years Active: 2015-2016
Publications (10 Years): 1

Top Topics

Integrated Circuit

Data Integration

Evolutionary Algorithm

Top Venues

Publications

Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
The influence of device morphology on wafer-level bonding with polymer-coated layer. 3DIC (2016)
Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. 3DIC (2015)