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Low temperature (<180 °C) bonding for 3D integration.

Yan-Pin HuangRuoh-Ning TzengYu-San ChienMing-Shaw ShyTeu-Hua LinKuo-Hua ChenChing-Te ChuangWei HwangChi-Tsung ChiuHo-Ming TongKuan-Neng Chen
Published in: 3DIC (2013)
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