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Wafer-level 3D integration technology.
Steven J. Koester
Albert M. Young
Roy R. Yu
Sampath Purushothaman
Kuan-Neng Chen
Douglas C. La Tulipe Jr.
Narender Rana
Leathen Shi
Matthew R. Wordeman
Edmund J. Sprogis
Published in:
IBM J. Res. Dev. (2008)
Keyphrases
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cost effective
case study
data processing
machine learning
data fusion
key technologies
integrated circuit
real time
databases
neural network
artificial intelligence
decision making
image sequences