Edmund J. Sprogis

Publication Activity (10 Years)

Years Active: 2005-2008
Publications (10 Years): 0

Publications

John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright
Three-dimensional silicon integration. IBM J. Res. Dev. 52 (6) (2008)
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker
3D chip stacking with C4 technology. IBM J. Res. Dev. 52 (6) (2008)
Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis
Wafer-level 3D integration technology. IBM J. Res. Dev. 52 (6) (2008)
Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52 (6) (2008)
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52 (6) (2008)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41 (8) (2006)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC (2005)
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49 (4-5) (2005)