Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.
John U. KnickerbockerPaul S. AndryL. Paivikki BuchwalterAlina DeutschRaymond R. HortonKeith A. JenkinsYoung Hoon KwarkGerald McVickerChirag S. PatelRobert J. PolastreChristian D. SchusterArun SharmaSri M. Sri-JayanthaChristopher W. SurovicCornelia K. TsangBucknell C. WebbSteven L. WrightSamuel R. McKnightEdmund J. SprogisBing DangPublished in: IBM J. Res. Dev. (2005)
Keyphrases
- high density
- rapid development
- low cost
- case study
- high speed
- st century
- cost effective
- cmos technology
- paradigm shift
- metal oxide semiconductor
- technical issues
- data processing
- current status
- computer systems
- development process
- low power
- software engineering
- design tools
- silicon on insulator
- field effect transistors
- assistive technology
- support systems
- future development
- communication technologies
- web technologies
- e learning
- coarse to fine
- wireless networks
- information processing