Bucknell C. Webb

Publication Activity (10 Years)

Years Active: 2005-2013
Publications (10 Years): 0

Top Topics

Silicon Dioxide

Top Venues

IEEE J. Solid State Circuits

Publications

Noah Sturcken, Eugene J. O'Sullivan, Naigang Wang, Philipp Herget, Bucknell C. Webb, Lubomyr T. Romankiw, Michele Petracca, Ryan Davies, Robert E. Fontana, Gary M. Decad, Ioannis Kymissis, Angel V. Peterchev, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard
A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer. IEEE J. Solid State Circuits 48 (1) (2013)
Noah Sturcken, Eugene J. O'Sullivan, Naigang Wang, Philipp Herget, Bucknell C. Webb, Lubomyr T. Romankiw, Michele Petracca, Ryan Davies, Robert E. Fontana, Gary M. Decad, Ioannis Kymissis, Angel V. Peterchev, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard
. ISSCC (2012)
John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright
Three-dimensional silicon integration. IBM J. Res. Dev. 52 (6) (2008)
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker
3D chip stacking with C4 technology. IBM J. Res. Dev. 52 (6) (2008)
Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52 (6) (2008)
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52 (6) (2008)
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49 (4-5) (2005)