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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
Paul S. Andry
Cornelia K. Tsang
Bucknell C. Webb
Edmund J. Sprogis
Steven L. Wright
Bing Dang
Dennis G. Manzer
Published in:
IBM J. Res. Dev. (2008)
Keyphrases
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plasma etching
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