Bing Dang

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 8

Top Topics

Multiple Sensors

Greenhouse Gases

Digital Technologies

Top Venues

Publications

Italo Buleje, Vince S. Siu, Kuan Yu Hsieh, Nigel Hinds, Bing Dang, Erhan Bilal, Thanhnha Nguyen, Ellen E. Lee, Colin A. Depp, Jeffrey L. Rogers
A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring. CoRR (2023)
Italo Buleje, Vince S. Siu, Kuan Yu Hsieh, Nigel Hinds, Bing Dang, Erhan Bilal, Thanhnha Nguyen, Ellen E. Lee, Colin A. Depp, Jeffrey L. Rogers
A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring. ICDH (2023)
Vince S. Siu, Kuan Yu Hsieh, Italo Buleje, Takashi Itoh, Tian Hao, Ben Civjan, Nigel Hinds, Bing Dang, Jeffrey L. Rogers, Bo Wen
Health Guardian: Using Multi-modal Data to Understand Individual Health. ICDH (2023)
Vince S. Siu, Kuan Yu Hsieh, Italo Buleje, Takashi Itoh, Tian Hao, Ben Civjan, Nigel Hinds, Bing Dang, Jeffrey L. Rogers, Bo Wen
Health Guardian: Using Multi-modal Data to Understand Individual Health. CoRR (2023)
Bo Wen, Vince S. Siu, Italo Buleje, Kuan Yu Hsieh, Takashi Itoh, Lukas Zimmerli, Nigel Hinds, Elif Eyigöz, Bing Dang, Stefan von Cavallar, Jeff Rogers
Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research. ICDH (2022)
Bo Wen, Vince S. Siu, Italo Buleje, Kuan Yu Hsieh, Takashi Itoh, Lukas Zimmerli, Nigel Hinds, Elif Eyigöz, Bing Dang, Stefan von Cavallar, Jeffrey L. Rogers
Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research. CoRR (2022)
Bing Dang, John Dicarlo, Stanislav Lukashov, Nigel Hinds, Jenna Reinen, Bo Wen, Tian Hao, Erhan Bilal, Jeff Rogers
Development of a Smart Sleep Mask with Multiple Sensors. EMBC (2021)
Yeyuan Huang, Ang Li, Pinhua Xie, Zhaokun Hu, Jin Xu, Xiaoyi Fang, Hongmei Ren, Xiaomei Li, Bing Dang
NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing. Remote. Sens. 12 (16) (2020)
Kevin Tien, Noah Sturcken, Naigang Wang, Jae-woong Nah, Bing Dang, Eugene J. O'Sullivan, Paul S. Andry, Michele Petracca, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors. VLSIC (2015)
Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. IEEE J. Solid State Circuits 47 (4) (2012)
Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC (2008)
John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright
Three-dimensional silicon integration. IBM J. Res. Dev. 52 (6) (2008)
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker
3D chip stacking with C4 technology. IBM J. Res. Dev. 52 (6) (2008)
Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52 (6) (2008)
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52 (6) (2008)
Muhannad S. Bakir, Bing Dang, James D. Meindl
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC (2007)
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49 (4-5) (2005)