Muhannad S. Bakir

Publication Activity (10 Years)

Years Active: 2002-2023
Publications (10 Years): 16

Top Topics

Procrustes Analysis

Design Space Exploration

Top Venues

IEEE J. Emerg. Sel. Topics Circuits Syst.

Publications

Wantong Li, Madison Manley, James Read, Ankit Kaul, Muhannad S. Bakir, Shimeng Yu
H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention. IEEE Trans. Very Large Scale Integr. Syst. 31 (10) (2023)
Yandong Luo, Sourav Dutta, Ankit Kaul, Sung Kyu Lim, Muhannad S. Bakir, Suman Datta, Shimeng Yu
A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect. IEEE J. Emerg. Sel. Topics Circuits Syst. 12 (2) (2022)
Jiaao Lu, Muneeb Zia, Matthew J. Williams, Amanda L. Jacob, Bryce Chung, Samuel J. Sober, Muhannad S. Bakir
High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording. EMBC (2022)
Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S. Bakir
Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management. IEEE Access 10 (2022)
Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 3DIC (2021)
Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. 3DIC (2021)
Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury
A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration. VLSI-SOC (2020)
Md Obaidul Hossen, Yang Zhang, Hesam Fathi Moghadam, Yue Zhang, Michael Dayringer, Muhannad S. Bakir
Design Space Exploration of Power Delivery For Advanced Packaging Technologies. CoRR (2020)
Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury
Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication. VLSI-SoC (Selected Papers) (2020)
Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. 3DIC (2019)
Pyungwoo Yeon, Muhannad S. Bakir, Maysam Ghovanloo
free-floating wireless implantable neural recording SoC. CICC (2018)
Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. BioCAS (2017)
Muhannad S. Bakir
PhD forum: Heterogeneous interconnection of ICs using stitch-chips. VLSI-SoC (2017)
Yang Zhang, Xuchen Zhang, William Wahby, Muhannad S. Bakir
Design considerations for 2.5-D and 3-D integration accounting for thermal constraints. 3DIC (2016)
Muneeb Zia, Chaoqi Zhang, Hyun Suk Yang, Li Zheng, Muhannad S. Bakir
Chip-to-chip interconnect integration technologies. IEICE Electron. Express 13 (6) (2016)
William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir
The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. 3DIC (2016)
Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang, Muhannad S. Bakir
Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. BioCAS (2015)
Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir
Embedded cooling technologies for densely integrated electronic systems. CICC (2015)
Hanju Oh, Gary S. May, Muhannad S. Bakir
Silicon interposer platform with low-loss through-silicon vias using air. 3DIC (2015)
Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. 3DIC (2014)
Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 3DIC (2014)
William Wahby, Ashish Dembla, Muhannad S. Bakir
Evaluation of 3DICs and fabrication of monolithic interlayer vias. 3DIC (2013)
Yue Zhang, Hanju Oh, Muhannad S. Bakir
Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs. 3DIC (2013)
Li Zheng, Muhannad S. Bakir
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer. SoCC (2012)
James D. Meindl, Azad Naeemi, Muhannad S. Bakir, R. Murali
Nanoelectronics in retrospect, prospect and principle. ISSCC (2010)
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim
Co-design of signal, power, and thermal distribution networks for 3D ICs. DATE (2009)
Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC (2008)
Muhannad S. Bakir, Bing Dang, James D. Meindl
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC (2007)
Azad Naeemi, Muhannad S. Bakir
Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities. SoCC (2006)
Kaveh Shakeri, Muhannad S. Bakir, James D. Meindl
Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution. SoCC (2004)
Muhannad S. Bakir, Hollie A. Reed, Anthony V. Mule, Paul A. Kohl, Kevin P. Martin, James D. Meindl
Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection. CICC (2002)