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Muneeb Zia
Publication Activity (10 Years)
Years Active: 2014-2022
Publications (10 Years): 3
Top Topics
Programmable Logic
Vlsi Design
Magnetic Recording
Cell Division
Top Venues
BioCAS
3DIC
IEEE Trans. Circuits Syst. II Express Briefs
IEICE Electron. Express
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Publications
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Jiaao Lu
,
Muneeb Zia
,
Matthew J. Williams
,
Amanda L. Jacob
,
Bryce Chung
,
Samuel J. Sober
,
Muhannad S. Bakir
High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording.
EMBC
(2022)
Pyungwoo Yeon
,
Joe L. Gonzalez
,
Muneeb Zia
,
Sreejith Kochupurackal Rajan
,
Gary S. May
,
Muhannad S. Bakir
,
Maysam Ghovanloo
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes.
BioCAS
(2017)
Muneeb Zia
,
Chaoqi Zhang
,
Hyun Suk Yang
,
Li Zheng
,
Muhannad S. Bakir
Chip-to-chip interconnect integration technologies.
IEICE Electron. Express
13 (6) (2016)
Wen Yueh
,
Subho Chatterjee
,
Muneeb Zia
,
Swarup Bhunia
,
Saibal Mukhopadhyay
A Memory-Based Logic Block With Optimized-for-Read SRAM for Energy-Efficient Reconfigurable Computing Fabric.
IEEE Trans. Circuits Syst. II Express Briefs
(6) (2015)
Muneeb Zia
,
Chaoqi Zhang
,
Paragkumar Thadesar
,
Tracy Hookway
,
Taiyun Chi
,
Joe L. Gonzalez
,
Todd C. McDevitt
,
Hua Wang
,
Muhannad S. Bakir
Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications.
BioCAS
(2015)
Chaoqi Zhang
,
Paragkumar Thadesar
,
Muneeb Zia
,
Thomas E. Sarvey
,
Muhannad S. Bakir
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.
3DIC
(2014)