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Thomas E. Sarvey
Publication Activity (10 Years)
Years Active: 2014-2016
Publications (10 Years): 2
Top Topics
Thermal Conductivity
Finite Element Analysis
Air Temperature
Enabling Technologies
Top Venues
3DIC
CICC
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Publications
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William Wahby
,
Thomas E. Sarvey
,
Hardik Sharma
,
Hadi Esmaeilzadeh
,
Muhannad S. Bakir
The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study.
3DIC
(2016)
Thomas E. Sarvey
,
Yang Zhang
,
Li Zheng
,
Paragkumar Thadesar
,
Ravi Gutala
,
Colman Cheung
,
Arifur Rahman
,
Muhannad S. Bakir
Embedded cooling technologies for densely integrated electronic systems.
CICC
(2015)
Chaoqi Zhang
,
Paragkumar Thadesar
,
Muneeb Zia
,
Thomas E. Sarvey
,
Muhannad S. Bakir
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.
3DIC
(2014)
Yang Zhang
,
Thomas E. Sarvey
,
Muhannad S. Bakir
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation.
3DIC
(2014)