Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation.
Yang ZhangThomas E. SarveyMuhannad S. BakirPublished in: 3DIC (2014)
Keyphrases
- infrared
- real world
- lessons learned
- machine learning
- power plant
- solder ball connect
- genetic algorithm
- injection lasers
- thermal infrared
- visible spectrum
- neural network
- steady state
- relational databases
- technical challenges
- finite element analysis
- heat transfer
- similarity measure
- case study
- air temperature
- thermal conductivity
- information systems
- artificial intelligence